By Fred Roozeboom (auth.), Fred Roozeboom (eds.)
Rapid thermal and built-in processing is an rising single-wafer expertise in ULSI semiconductor production, electric engineering, utilized physics and fabrics technology. right here, the physics and engineering of this know-how are mentioned on the graduate point. 3 interrelated components are coated. First, the thermophysics of photon-induced annealing of semiconductor and comparable fabrics, together with basic pyrometry and emissivity matters, the modelling of reactor designs and procedures, and their relation to temperature uniformity. moment, procedure integration, treating the advances in easy apparatus layout, scale-up, built-in cluster-tool gear, together with wafer cleansing and built-in processing. 3rd, the deposition and processing of skinny epitaxial, dielectric and steel movies, protecting selective deposition and epitaxy, built-in processing of layer stacks, and new parts of power software, akin to the processing of III-V semiconductor buildings and skinny- movie head processing for high-density magnetic facts storage.
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Non-orthodox process applications outside the semiconductor field will grow rapidly, such as in the processing of flat panel displays or magnetiC data storage devices (see Chapter 19). These applications will pose new, unique 31 equipment obstacles. General: • There is no consensus among the equipment manufacturers and users on the optimum reactor design. Partly this is due to design problems which are specific for each application. • Modeling is a powerful development tool in both reactor and process design.
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